DEMI 400

DEMI 400

Your entry-level resin and support removal solution for SLA, DLP, PolyJet and wax in a nifty format.

DEMI 400 postprocessing solution

Hands-free postprocessing of your SLA, DLP, PolyJet and wax parts

The PostProcess DEMI 400 Series Support & Resin Removal solutions deliver automated removal of resin, wax and support for SLA, DLP, PolyJet, wax and CLIP based 3D print technologies.

Proprietary software, exclusive detergents, time, and exact temperature based on material and geometry of your part, the DEMI 400 gives you precise, hands-free post-printing for your workflow.

Get consistently high quality parts in the shortest amount of time

The DEMI 400 Series includes Submersed Vortex Cavitation (SVC) technology. It is an innovative function that uses a rotating motion while the 3D printed part is immersed in fluid. This ensures even exposure to the mechanical agitation, resulting in consistently high quality parts.

Watch the video to learn more about how PostProcess Technologies’ solutions work.

Why choose PostProcess Technologies?

  • Eliminate messy and time-consuming postprocessing
  • Increase part quality and lead times on printed parts
  • Put your resources to good use in other parts of your 3D print operations
  • Make your postprocessing workflow more sustainable with formulated chemicals with minimal environmental impact


  • Compatible technologies: SLA, DLP, PolyJet, Wax & CLIP
  • Envelope: 355 x 355 x 355 mm
  • Footprint: 736 x 914 x 1092 mm
  • Capacity: 64 litres

After having tried the PostProcess solution, it’s hard to imagine ever going back to using IPA.

The benefit here you can see is improving from 30 minutes per part down to all 10 parts in less than 5 minutes.

Lukass Legzdins R&D Director Splitvision

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